Search
Advanced search
Filter by category
Filter by committee
Search results
-
After two successful pilots, ASTM International, a global standards organization, is expanding its Emerging Professionals program . The program will provide free airfare and lodging this year for up to 24 participants to attend a leadership development workshop held during an ASTM International conference – “committee week” – where technical experts in their industries create and revise…, ASTM Staff Contact:, Katerina Koperna, tel +1.610.832.9728; kkoperna@astm.org , Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org R elease #10276
-
A new standard will help test technology that is used in many electronic devices. According to ASTM members Lin Tingyu (National Center for Advanced Packaging) and Hi Jinjiang (Grikin Advanced Materials Co. Ltd.), the new standard will provide a baseline of quality, reliability, and process for manufacturers of “sputtering targets,” which are often used for thin-film deposition, etching, and…, ASTM Committee F01 on Electronics Next Meeting:, January 31, 2017, January Committee Week, Norfolk, Va., Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org, Technical Contact:, Lin Tingyu, National Center for Advanced Packaging, Wuxi, Jiangsu province, China, tel +1.535.805.3318; tingyulin@ncp-cn.com, ASTM Staff Contact:, Kelly Paul, tel +1.610.832.9745; kpaul@astm.org Release #10163
-
Kristen Duda, student at the University of Pennsylvania, Philadelphia, Pennsylvania, USA has received the Mary R. Norton Memorial Scholarship for Women Award from ASTM Committee E04 on Metallography. The committee noted Duda’s demonstrated ability, evident potential, and career goals in the material science industry. Duda previously served as a material technologies intern at Air Products, Exton…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #10139
-
ASTM grain size is a property written into many specifications for metals, with finer grain sizes generally indicating better mechanical properties, such as formability. While measuring certain materials for such properties can be difficult, electron backscatter diffraction can provide precise determinations as well as give information on grain size distribution and statistics. A new ASTM…
-
A recent revision to ASTM International standard E384 , Test Method for Knoop and Vickers Hardness of Materials, expands the range of its coverage. The standard is under the jurisdiction of Subcommittee E04.05 on Microindentation Hardness Testing, part of ASTM International Committee E04 on Metallography. The revision incorporates ASTM E92 , Test Method for Vickers Hardness of Metallic Materials…
-
Since 1998, when ASTM International Committee F05 on Business Imaging Products first approved standard F 1856 , Practice for Determining Toner Usage for Printer Cartridges, there has been a rapid increase in the use of color in office printing. In order to address this important change, Subcommittee F05.04 on Electrostatic Imaging Products has developed F 2632 , Practice for Determining the Toner…
-
The ability to determine the number of pages an ink jet printer cartridge will print in its lifetime is essential for anyone who manufactures or remanufactures them. A new ASTM International standard, F 2555 , Practice for Determining Page Yield of Ink Jet Printer Cartridges — Continuous Printing Method, has been developed to aid in this endeavor. Practice F 2555 is under the jurisdiction of…
-
ASTM International Committee F05 on Business Imaging Products is currently seeking participation in the development of proposed new standards under the jurisdiction of Subcommittee F05.07 on Ink Jet Imaging Products. Users, original equipment manufacturers and ink producers are needed to assist in the following task groups: F05.07.01 This task group is working on developing a user-friendly…
-
A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
-
ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…