A new standard will help test technology that is used in many electronic devices.

According to ASTM members Lin Tingyu (National Center for Advanced Packaging) and Hi Jinjiang (Grikin Advanced Materials Co. Ltd.), the new standard will provide a baseline of quality, reliability, and process for manufacturers of “sputtering targets,” which are often used for thin-film deposition, etching, and analysis.

Regulatory bodies will be able to use the standard as a reference point to determine product qualification. 

Laboratories will benefit from the standard’s quantitative description of sputtering-target properties. This will allow labs to perform more valuable analysis based on clearly defined material.

The standard, created by ASTM’s committee on electronics (F01) will soon be published as Guide for High-Purity Copper Sputtering Target used for TSV Metallization (F3192).

To purchase standards, visit www.astm.org and search by the standard designation, or contact ASTM Customer Relations (tel +1.877.909.ASTM; sales@astm.org). ASTM welcomes participation in the development of its standards. Become a member at www.astm.org/JOIN.

For more news in this sector, visit www.astm.org/sn-metals.

ASTM Committee F01 on Electronics Next Meeting: January 31, 2017, January Committee Week, Norfolk, Va.
Media Inquiries: Dan Bergels, tel +1.610.832.9602; dbergels@astm.org
Technical Contact: Lin Tingyu, National Center for Advanced Packaging, Wuxi, Jiangsu province, China, tel +1.535.805.3318; tingyulin@ncp-cn.com
ASTM Staff Contact: Kelly Paul, tel +1.610.832.9745; kpaul@astm.org

Release #10163