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ASTM International’s Committee on Copper and Copper Alloys ( B05 ) will present its top annual award – the Award of Merit – to James H. Michel of The Copper Development Association, in New York, New York, U.S.A. The prestigious award, which includes the accompanying title of fellow, is ASTM’s highest recognition for individual contributions to developing standards. The committee is honoring…, Media Inquiries:, Dan Bergels, tel+1.610.832.9602; dbergels@astm.org R elease #10291
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A new standard will help test technology that is used in many electronic devices. According to ASTM members Lin Tingyu (National Center for Advanced Packaging) and Hi Jinjiang (Grikin Advanced Materials Co. Ltd.), the new standard will provide a baseline of quality, reliability, and process for manufacturers of “sputtering targets,” which are often used for thin-film deposition, etching, and…, ASTM Committee F01 on Electronics Next Meeting:, January 31, 2017, January Committee Week, Norfolk, Va., Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org, Technical Contact:, Lin Tingyu, National Center for Advanced Packaging, Wuxi, Jiangsu province, China, tel +1.535.805.3318; tingyulin@ncp-cn.com, ASTM Staff Contact:, Kelly Paul, tel +1.610.832.9745; kpaul@astm.org Release #10163
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ASTM International’s Committee on Copper and Copper Alloys (B05) has presented its top annual award – the Award of Merit – to Andrew Kireta, Jr. of the Copper Development Association, Inc. in Franklin, Ind., U.S.A. The prestigious award, which includes the accompanying title of fellow, is ASTM’s highest recognition for individual contributions to developing standards. The committee honored Kireta…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #10075
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Charles B. Blanton, corporate director of environmental, healthy and safety, Mueller Industries, Inc., Memphis, Tenn., has been named chairman of ASTM International Committee B05 on Copper and Copper Alloys . Formed in 1928, B05 has over 210 members representing 9 countries, and includes 12 technical subcommittees that oversee 150 standards related to the development of qualifications data and…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #10054
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Three proposed ASTM International standards will provide a base for the evaluation of the antimicrobial efficacy of solid copper materials. The proposed standards are being developed by Subcommittee B05.06, Methods of Test, part of ASTM International Committee B05 on Copper and Copper Alloys . The three proposed standards are: • ASTM WK42235 , Test Method for Efficacy of Copper Alloy Surfaces as…, ASTM Committee B05 Next Meeting:, Oct. 21-23, 2013, October Committee Week, Jacksonville, Fla., Technical Contact:, James H. Michel, Copper Development Association Inc., New York, N.Y., Phone: 212-251-7210; j ames.michel@copperalliance.us, ASTM Staff Contact:, Jennifer Rodgers, Phone: 610-832-9694; jrodgers@astm.org, ASTM PR Contact:, Barbara Schindler, Phone: 610-832-9603; bschindl@astm.org Release #9439
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A newly approved ASTM copper standard focuses on the mechanical properties of machining brasses. ASTM B981/B981M , Specification for Low Leaded Brass Rod, Bar and Shapes, was developed by Subcommittee B05.02 on Rod, Bar, Wire, Shapes and Forgings , part of ASTM International Committee B05 on Copper and Copper Alloys . “Since 1997, there has been increasing legislation, regulation and voluntary…, ASTM Committee B05 Next Meeting:, April 15-17, 2013, April Committee Week, Indianapolis, Ind., Technical Contact:, Larry Muller, Chase Brass and Copper Co., Montpelier, Ohio, Phone: 419-485-8932; lmuller@chasebrass.com, ASTM Staff Contact:, Jennifer Rodgers, Phone: 610-832-9694; jrodgers@astm.org, ASTM PR Contact:, Barbara Schindler, Phone: 610-832-9603; bschindl@astm.org R elease #9307
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ASTM International Committee B05 on Copper and Copper Alloys has created a new task group, TG9018, which will be focused on the Antimicrobial Applications of Copper and Copper Alloys. The task group was formed following the U.S. Environmental Protection Agency's announcement of its registration of copper alloys as antimicrobial materials with specific health claims. According to James Michel,…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…
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ASTM International Subcommittee F01.11 has recently changed its name from Quality and Hardness Assurance to Nuclear and Space Radiation Effect. The subcommittee is under the jurisdiction of ASTM International Committee F01 on Electronics. According to William Alfonte, chair of F01.11, the title of the subcommittee has been changed to more accurately reflect the scope of its current and future…