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ASTM International, one of the largest voluntary standards development organizations in the world, announces the formation of ASTM Committee F42 on Additive Manufacturing Technologies. The new, first-time standards initiative was driven by the cooperative efforts of ASTM and the Society of Manufacturing Engineers (SME) to bring forward consensus standards that will support the adoption of…
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A series of focus groups conducted by the Adhesive and Sealant Council, Inc., has led to the ongoing development of a proposed new standard, WK14701 , New Symbols for Adhesive Applications. WK14701 is being developed by Subcommittee D14.04 on Terminology, part of ASTM International Committee D14 on Adhesives. According to Lawrence D. Sloan, president, Adhesive and Sealant Council, and D14.04…
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All interested parties are invited to contribute to the ongoing development of WK11541 , Specification for Structural Insulated Panel (SIP) Adhesives for Bonding Oriented Strand Board (OSB) Facers to Rigid Cellular Polystyrene Thermal Insulation Core Materials. The proposed standard is under the jurisdiction of Subcommittee D14.70 on Construction Adhesives, which is part of ASTM International…
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A new ASTM International standard, D 7247 , Test Method for Evaluating the Shear Strength of Adhesive Bonds in Laminated Wood Products at Elevated Temperature, will be an important new tool for anyone working with engineered wood products. The proposal for D 7247 originated in Committee D07 on Wood and members of both that committee and Committee D14 on Adhesives worked together to develop it.…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…
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ASTM International Subcommittee F01.11 has recently changed its name from Quality and Hardness Assurance to Nuclear and Space Radiation Effect. The subcommittee is under the jurisdiction of ASTM International Committee F01 on Electronics. According to William Alfonte, chair of F01.11, the title of the subcommittee has been changed to more accurately reflect the scope of its current and future…
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ASTM International Committee F01 on Electronics is currently seeking participation for any interested parties in the development of a proposed new standard, WK6499, Test Method for Determining Sputtering Target Utilization. The proposed new standard is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. Target utilization is the amount of target material that is available for…