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A new standard will help test technology that is used in many electronic devices. According to ASTM members Lin Tingyu (National Center for Advanced Packaging) and Hi Jinjiang (Grikin Advanced Materials Co. Ltd.), the new standard will provide a baseline of quality, reliability, and process for manufacturers of “sputtering targets,” which are often used for thin-film deposition, etching, and…, ASTM Committee F01 on Electronics Next Meeting:, January 31, 2017, January Committee Week, Norfolk, Va., Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org, Technical Contact:, Lin Tingyu, National Center for Advanced Packaging, Wuxi, Jiangsu province, China, tel +1.535.805.3318; tingyulin@ncp-cn.com, ASTM Staff Contact:, Kelly Paul, tel +1.610.832.9745; kpaul@astm.org Release #10163
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ASTM International has fully redesigned its International Laboratory Directory, the only directory in the world dedicated to helping manufacturers find the right labs to test their products. Independent laboratories throughout the world rely on thousands of standards and test methods, including many developed by ASTM International. By working with these labs, manufacturers can help ensure that…, Contact:, Anna Spektor, tel +1.610.832.9756; aspektor@astm.org, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #10110
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A newly approved ASTM International standard will advance the cause of architectural preservation. The new standard, ASTM C1713 , Specification for Mortars for the Repair of Historic Masonry, was developed by Subcommittee C12.03 on Specifications for Mortars, part of ASTM International Committee C12 on Mortars and Grouts for Masonry Units. John Wathne, structural engineer and president of…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…
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ASTM International Subcommittee F01.11 has recently changed its name from Quality and Hardness Assurance to Nuclear and Space Radiation Effect. The subcommittee is under the jurisdiction of ASTM International Committee F01 on Electronics. According to William Alfonte, chair of F01.11, the title of the subcommittee has been changed to more accurately reflect the scope of its current and future…
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ASTM International Committee F01 on Electronics is currently seeking participation for any interested parties in the development of a proposed new standard, WK6499, Test Method for Determining Sputtering Target Utilization. The proposed new standard is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. Target utilization is the amount of target material that is available for…