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ASTM International announced today the Journal of Testing and Evaluation, the organization’s flagship journal, received an increased 2021 impact factor rating of 1.333, up 5.5% from the previous year. The impact factor is calculated each year by Clarivate Analytics and given to journals that appear in their database, Science Citation Index. Launched in 1973, the journal is a multi-disciplinary…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #11472 ###
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Janet L. Gbur, Ph.D., research biomedical engineer and investigator in the Advanced Platform Technology Center at the Louis Stokes Cleveland VA Medical Center (Cleveland, Ohio, USA), will serve a three-year term on the ASTM International board of directors. Gbur also serves as senior research associate in the department of materials science and engineering and a member of the Advanced…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #11356 ###
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ASTM International’s metallography committee (E04) has honored Margaret Wilson, graduate student at Dalhousie University, with the Mary R. Norton Scholarship Award for Women. The $1,000 scholarship encourages women undergraduate seniors or first-year graduate students to pursue the study of physical metallurgy or materials science with an emphasis on the relationship of microstructure to material…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #11014 ###
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In light of COVID-19 (coronavirus) and ongoing safety concerns for members and staff, ASTM International announced today that all previously scheduled in-person May standards development meetings (including independent meetings) have been canceled. Earlier this month, ASTM International announced the cancellation of all April in-person meetings . These decisions were based on several factors,…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #11001 ###
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A new standard will help test technology that is used in many electronic devices. According to ASTM members Lin Tingyu (National Center for Advanced Packaging) and Hi Jinjiang (Grikin Advanced Materials Co. Ltd.), the new standard will provide a baseline of quality, reliability, and process for manufacturers of “sputtering targets,” which are often used for thin-film deposition, etching, and…, ASTM Committee F01 on Electronics Next Meeting:, January 31, 2017, January Committee Week, Norfolk, Va., Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org, Technical Contact:, Lin Tingyu, National Center for Advanced Packaging, Wuxi, Jiangsu province, China, tel +1.535.805.3318; tingyulin@ncp-cn.com, ASTM Staff Contact:, Kelly Paul, tel +1.610.832.9745; kpaul@astm.org Release #10163
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Kristen Duda, student at the University of Pennsylvania, Philadelphia, Pennsylvania, USA has received the Mary R. Norton Memorial Scholarship for Women Award from ASTM Committee E04 on Metallography. The committee noted Duda’s demonstrated ability, evident potential, and career goals in the material science industry. Duda previously served as a material technologies intern at Air Products, Exton…, Media Inquiries:, Dan Bergels, tel +1.610.832.9602; dbergels@astm.org Release #10139
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ASTM grain size is a property written into many specifications for metals, with finer grain sizes generally indicating better mechanical properties, such as formability. While measuring certain materials for such properties can be difficult, electron backscatter diffraction can provide precise determinations as well as give information on grain size distribution and statistics. A new ASTM…
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A recent revision to ASTM International standard E384 , Test Method for Knoop and Vickers Hardness of Materials, expands the range of its coverage. The standard is under the jurisdiction of Subcommittee E04.05 on Microindentation Hardness Testing, part of ASTM International Committee E04 on Metallography. The revision incorporates ASTM E92 , Test Method for Vickers Hardness of Metallic Materials…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…