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ASTM International Committee D10 on Packaging will present a Distribution Packaging Workshop on April 7, 2008, from 10 a.m. to noon. The workshop, which is being organized by the committee’s university liaison subcommittee, will occur during the Committee D10 meeting at the ASTM committee week in Anaheim, Calif. Workshop topics will include the following: • Single-Parcel Shipping Environment—…
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ASTM International Committee D10 on Packaging is reactivating Subcommittee D10.19 on Recycling/Disposability. All interested parties, particularly those who are concerned and knowledgeable about worldwide packaging and recycling issues, are invited to join in the standards developing activities of D10.19. Jan Gates, subcommittee chair, and principal packaging engineer at Abbott Vascular, hopes…
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ASTM International Committee C24 on Building Seals and Sealants invites interested parties to participate in the development of a proposed new standard that will use photographs to illustrate various types of sealant failures. WK11731 , Guide for Diagnosing Sealant Failure by Comparison to Reference Photographs, is under the jurisdiction of Subcommittee C24.10 on Specifications, Guides and…
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ASTM International Committee D10 on Packaging is currently inviting all interested parties to join a new D10 subcommittee, D10.97 on University Liaison. According to S. Paul Singh, professor, school of packaging, Michigan State University, and chair of D10’s division I, the purpose of the new subcommittee is twofold. “We want to allow university programs that teach and research in packaging to be…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…
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ASTM International Committee C24 on Building Seals and Sealants is currently working to fill a need for a weatherproofing sealant field test standard. The result, proposed standard WK7800, Guide for a Non-Destructive, Continuous, Field Test of Installed Weatherproofing Sealant, features a field test that has been used by sealant professionals for years, but has not, up to this point, been…
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ASTM International Committee D10 on Packaging has formed a new task group to investigate the possibilities of radio frequency identification (RFID) as a means of tracking packages. The task group is under the jurisdiction of Subcommittee D10.18 on Miscellaneous Packaging. The purpose of the task group is to develop standards to evaluate the performance of RFID tags used on packaging and…
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ASTM International Subcommittee F01.11 has recently changed its name from Quality and Hardness Assurance to Nuclear and Space Radiation Effect. The subcommittee is under the jurisdiction of ASTM International Committee F01 on Electronics. According to William Alfonte, chair of F01.11, the title of the subcommittee has been changed to more accurately reflect the scope of its current and future…
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ASTM International Committee E42 on Surface Analysis has approved a new standard, E 2382, Guide to Scanner and Tip Related Artifacts in Scanning Tunneling Microscopy and Atomic Force Microscopy. The guide, under the jurisdiction of Subcommittee E42.14 on STM/AFM, was proposed in order to assist new scanning probe microscopy users with more rapid recognition and assessment of artifacts in imaging…