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All interested parties are encouraged to participate in the development of a proposed new ASTM International standard, WK20460 , Specification for High Performance Tinned Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability. The proposed standard is being developed by Subcommittee B01.04 on Conductors of Copper and Copper Alloys, which is part of ASTM…
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A proposed new standard currently being developed by ASTM International Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry. The proposed standard, WK9490, Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials, is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. "The tantalum sputtering target…
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ASTM International Committee F01 on Electronics is currently developing a proposed new standard that will provide uniformity in the values reported for oxygen content in aluminum alloys used for sputtering targets in the manufacture of integrated circuits. The proposed standard, WK9120, Determination of Oxygen in High Purity Aluminum and Alloys in High Purity Aluminum Base by Inert Gas Fusion…
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ASTM International Subcommittee F01.11 has recently changed its name from Quality and Hardness Assurance to Nuclear and Space Radiation Effect. The subcommittee is under the jurisdiction of ASTM International Committee F01 on Electronics. According to William Alfonte, chair of F01.11, the title of the subcommittee has been changed to more accurately reflect the scope of its current and future…
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ASTM International Committee E42 on Surface Analysis has approved a new standard, E 2382, Guide to Scanner and Tip Related Artifacts in Scanning Tunneling Microscopy and Atomic Force Microscopy. The guide, under the jurisdiction of Subcommittee E42.14 on STM/AFM, was proposed in order to assist new scanning probe microscopy users with more rapid recognition and assessment of artifacts in imaging…
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ASTM International Committee F01 on Electronics is currently seeking participation for any interested parties in the development of a proposed new standard, WK6499, Test Method for Determining Sputtering Target Utilization. The proposed new standard is under the jurisdiction of Subcommittee F01.17 on Sputter Metallization. Target utilization is the amount of target material that is available for…