Participation is being sought for the development of a proposed new standard, WK15434, Test Method for Analysis of Tin-Based Solder Alloys Using Optical Emission Spectrometry. The proposed standard is being developed by Subcommittee F40.01 on Test Methods, which is part of ASTM International Committee F40 on Declarable Substances in Materials.
 
According to Dirk Wissmann, product manager, Spectro Analytical Instruments, and F40 member, the analytical requirements for solder manufacturers have become more challenging with the introduction of Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) legislation that governs the use of hazardous substances in electrical and electronic equipment. “For example, with the introduction of RoHS, new types of solder were developed that do not contain lead, cadmium and mercury above any regulated level,” says Wissmann. “To get comparable analysis results in different labs with different instrumentation, it is always best to describe the analytical procedure in as much detail as possible.”
 
Wissmann says that producers and users of tin-based solder alloys will be able to use the proposed standard to check base material for compliance as well as to monitor the solder bath for contamination and other changes during longer periods of use. The subcommittee welcomes all participation and would be particularly interested in having more manufacturers of tin-based solder material involved in the standards developing process.
 
For further technical information, contact Dirk Wissmann, Spectro Analytical Instruments, Kleve, Germany (phone: +49.2821.892.4147; dwissmann@spectro.com). Committee F40 will meet Nov. 14-16 at November Committee Week in Tampa, Fla. For membership or meeting information, contact Brynn Murphy, Technical Committee Operations, ASTM International (phone: 610/832-9640; bmurphy@astm.org).

Release #7772