ASTM International Committee D30 on Composite Materials is co-sponsoring the 25th Annual Technical Conference of the American Society for Composites, to be held Sept. 20-22, 2010, at the Dayton Marriot in Dayton, Ohio. Sponsored by the University of Dayton, the event will be held in conjunction with the 14th U.S.-Japan Conference on Composite Materials.
Papers for the conference are invited on the following topics of interest:
Joining and adhesive bonding;
The deadline for abstract submission is March 26, 2010. Notifications of acceptance will be received by April 9, 2010, with full papers being due on or before July 16, 2010.
Following the conference, ASTM Committee D30 will meet on Sept. 22-23, also at the Dayton Marriott. ASTM meetings are open to any interested party, membership is not required and there is no cost to attend. We encourage anyone with an interest or use for ASTM standards to attend the D30 meetings. Meeting registration will be available on the ASTM Web site beginning in July 2010.
To learn more about Committee D30 and for updated meeting information, visit www.astm.org/COMMIT/D30.htm. For further information on the conference and abstract submittal, go to http://asc2010.udayton.edu.
ASTM Committee D30 Next Meeting: April 21-22, 2010, St. Louis, Mo.
Technical Contact: Ronald Krueger, National Institute of Aerospace, Hampton, Va., Phone: 757-864-3482; rkrueger@nianet.org
ASTM Staff Contact: Jennifer Rodgers, Phone: 610-832-9694; jrodgers@astm.org
ASTM PR Contact: Barbara Schindler, Phone: 610-832-9603; bschindl@astm.org
Release #8420/Nov2009